Global Wafer Bonder Market to Touch USD 199.7 Mn by 2026 as per the Latest Research

The global Wafer Bonder market was valued at US$ 116.5 million in 2019 and it is expected to reach US$ 199.7 million by the end of 2026, growing at a CAGR of 7.7% during 2021-2026.

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.

The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world’s leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany’s SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.

Global Wafer Bonder Market: Drivers and Restrains

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Wafer Bonder Market: Segment Analysis

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027.

Key Companies profiled in this report are EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE and more in terms of market share by sales, revenue, average pricing, product type, margins, recent developments etc.

Find more details at:

Segment by Type

  • Semi-Automated Wafer Bonder
  • Automated Wafer Bonder

Segment by Application

  • MEMS
  • Advanced Packaging
  • CMOS
  • Others

Table of Content:

1 Wafer Bonder Market Overview

2 Market Competition by Manufacturers

3 Production and Capacity by Region

4 Global Wafer Bonder Consumption by Region

5 Production, Revenue, Price Trend by Type

6 Consumption Analysis by Application

7 Key Companies Profiled

8 Wafer Bonder Manufacturing Cost Analysis

9 Marketing Channel, Distributors and Customers

10 Market Dynamics

11 Production and Supply Forecast

12 Consumption and Demand Forecast

13 Forecast by Type and by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source

Media Contact

Company Name: The Market Reports

Contact Person: Shirish Gupta


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