Electronic Thermal Interface Materials Market Looks Bullish; Estimated to Grow at 5.4% CAGR from 2021-27

The global Electronic Thermal Interface Materials market was valued at US$ 788.5 million in 2020 and it is expected to reach US$ 1172.8 million by the end of 2027, growing at a CAGR of 5.4% during 2021-2027.

Thermal interface material is a kind of material applied between power devices and electronic radiators. It is mainly used to fill the micro voids and uneven holes on the surface caused by the connection or contact between the two materials to improve the heat dissipation performance.

Global Thermal Interface Materials key players are mainly located in US, Europe and Japan, like Dow, Panasonic, Parker Hannifin, Shin-Etsu Chemical, Laird, Henkel, Fujipoly, Tanyuan Technology and DuPont, etc. Global top five players hold a share nearly 40 percent.

Global Electronic Thermal Interface Materials Market: Drivers and Restrains

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Electronic Thermal Interface Materials Market: Segment Analysis

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027.

Key Companies profiled in this report are Dow, Panasonic, Parker Hannifin, Shin-Etsu Chemical, Laird, Henkel, Fujipoly, DuPont, Aavid (Boyd Corporation), 3M, Wacker, H.B. Fuller Company, Denka Company Limited, Dexerials Corporation, Tanyuan Technology, Jones Tech PLC, Shenzhen FRD Science & Technology and more in terms of market share by sales, revenue, average pricing, product type, margins, recent developments etc.

Find more details at: https://www.themarketreports.com/report/global-electronic-thermal-interface-materials-market-outlook

Segment by Type

  • Silicone Gasket
  • Graphite Pad
  • Thermal Conductive Paste
  • Thermal Conductive Adhesive Tape
  • Thermal Conductive Film
  • Phase Change Materials
  • Others

Segment by Application

  • LED Industry
  • Computer Industry
  • Energy Industry
  • Telecommunications Industry
  • Others

Table of Content:

1 Electronic Thermal Interface Materials Market Overview

2 Market Competition by Manufacturers

3 Production and Capacity by Region

4 Global Electronic Thermal Interface Materials Consumption by Region

5 Production, Revenue, Price Trend by Type

6 Consumption Analysis by Application

7 Key Companies Profiled

8 Electronic Thermal Interface Materials Manufacturing Cost Analysis

9 Marketing Channel, Distributors and Customers

10 Market Dynamics

11 Production and Supply Forecast

12 Consumption and Demand Forecast

13 Forecast by Type and by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source

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